Explore the application of advanced ALD technology in semiconductor manufacturing
Release time：
02 Oct,2024
Summary
Atomic layer deposition (ALD) is a precision thin film deposition technology that offers atomic-level control over film growth thickness, uniformity, and composition. In the semiconductor industry, ALD is widely used to fabricate metal oxides, silicon-based materials, and other functional thin films such as high-k dielectric layers, metal wires, and silicon dioxide. For example, ALD can be used to produce high-quality dielectric layers, improving transistor performance and efficiency and reducing power consumption.
ALD technology has broad application prospects in semiconductor manufacturing. As chip sizes continue to shrink and functional requirements increase, traditional processes are no longer sufficient. ALD technology enables precise control over material growth, ensuring product quality and performance. In addition, the ALD process enables uniform deposition of thin films, improving process repeatability and production stability.
In summary, ALD technology is of significant importance to the semiconductor manufacturing industry, improving product performance, reducing energy consumption, and promoting continuous process innovation. In the future, with the continuous advancement and expanding application range of ALD technology, its position in semiconductor manufacturing will be further consolidated, and it will demonstrate enormous potential in more fields.
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